It’s hard for the companies that make electronics to keep up with the needs of electronics that are getting tiny and difficult. To keep up with these changes, a lot of changes have been made to the paint jobs on printed circuit boards (PCBs). An important step forward is the ENEPIG finishing process, which stands for Electroless Nickel, Electroless Palladium, and Immersion Gold. We are going to talk about ENEPIG electroplating in this study. We’ll look at the main features of ENEPIG PCB technology and compare it to ENIG (Electroless Nickel, Immersion Gold).
ENEPIG vs. ENIG
Electroless Nickel, Immersion Gold (ENIG)
For many years, PCBs have been made with the ENIG surface finish. The covering is made up of two main layers: immersion gold comes first, followed by a thin layer of electroless nickel. When it comes to solderability, rust protection, and surface finish, ENIG is the best. The product has a good name for always working well, especially in situations where exact space is needed.
There is a problem with using ENIG. “Black pad” flaws can happen because the immersion gold used in this process is sometimes weak. These flaws can make the printed circuit board (PCB) less reliable in the long run. This flaw happens when the area where the gold and nickel layers meet gets weak, allowing the gold layer to separate from the nickel layer.
ENEPIG
The new technology called ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) makes it easier to finish the outside of PCBs. So that ENIG can do what it needs to do, an electroless palladium layer is put between the nickel and gold layers. These extra layers not only make the PCB more stable and good at what it does, but they also make it last longer. Learn more about it here.
The ENEPIG Electroplating Process
The ENEPIG process has several important steps that work together to make it work so well:
- Preparation of Substrate: The first step is to get the PCB base ready. This is usually made of FR-4 material and includes cleaning and activating the surface. This process makes sure that the layers that come after it stick well to each other.
- Electroless Nickel Deposition: During the process, electroless nickel is deposited on the material to make a protective layer. Its job is to keep the copper traces safe from oxidation and diffusion. The nickel layer makes sure that the palladium layer sticks well on top of it.
- Electroless Palladium Deposition: An electroless palladium layer is put on top of the nickel layer. Palladium is very flexible, which helps to fix the problem of brittleness seen in ENIG. It also makes it easier for the liquid gold layer to stick.
- Immersion Gold Plating: The last step is to put the PCB in a fluid that has gold in it. The gold is deposited on top of the palladium layer, which makes the surface smooth, easy to join, and very resistant to rust.
Advantages of ENEPIG
Enhanced Reliability:
Because it has a palladium layer, the ENEPIG coating is more reliable than the ENIG coating. The performance of the product stays the same for a long time because this layer stops black pad flaws from happening.
Fine-Pitch Compatibility:
ENEPIG is a good choice for fine-pitch uses that need accurate soldering because it has a flat surface finish and a thickness that is the same all over.
Multiple Soldering Cycles:
When it comes to difficult building processes, ENEPIG is great because it can be soldered over and over again without losing its ability to do so.
Reduced Whisker Growth:
People know that ENEPIG can slow down the growth of whiskers, which is very useful in high-reliability cases where short circuits must be avoided.
Environmental Friendliness:
Some people think that ENEPIG is better for the environment than methods like hard gold plating because it uses less valuable metals.
ENEPIG PCB Technology: The Future of Electronics
As electronics get smaller and more complicated, the need for solid, high-performance PCBs grows. To meet these needs, the ENEPIG system is a big step forward. As electronics get better, ENEPG will play a big role. It is more stable, works with fine-pitch technology, and is better for the environment.
Conclusion
In conclusion, here we find out why ENEPIG electroplating is better than ENIG electroplating. With better performance and unbeatable dependability, ENEPIG is the best choice. ENEPIG is the best way to finish the surface of your printed circuit boards (PCBs).
ENEPIG is the best because it has a sophisticated layer structure and a well-known electroplating method. With this amazing surface finish, you can experience the highest level of quality and dependability. Get rid of the bad options and welcome the future of PCBs with ENEPIG.
Welcome the amazing ENEPIG technology; it is without a doubt the next step in the changing electronic industry. In addition to this technology, PCB has more technologies, please visit KingSun official website directly: https://kingsunpcba.com/